Evatec Process Systems (CH)
SDS 231 Wafer Handling:

This double robot handling has been developed for the flexible cassette-to-cassette loading of an SDS 231 sputtering system. It allows to process 6- and 8-inch wafers which can be coated on either side. The wafers get masked, enabling a deposition with "edge exclusion”.

Key features:

  • Automated cassette-to-cassette operation
  • Mixed processing of 6 "and 8" wafers possible
  • Masked deposition for edge exclusion
  • Frontside and backside metallization

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